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Epoxy Underfill Encapsulant For CSP/BGA/uBGA of mobile phone, laptop
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Key attributes
Industry-specific attributes
CAS No.
Unspecified
Other attributes
Place of Origin
Guangdong, China
Main Raw Material
Epoxy
Usage
CSP/BGA/uBGA assembly
Other Names
underfill adhesive
MF
Mixture
EINECS No.
Unspecified
Classification
Other Adhesives
Brand Name
WTS
Model Number
7513
Type
Liquid Glue
Color
black
Packaging and delivery
Packaging Details
30ml 250ml 1000ml
Port
Hongkong/Shenzhen/Guangzhou
Supply Ability
Supply Ability
100 Kilogram/Kilograms per Day
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Product descriptions from the supplier
Minimum order quantity: 2 liters
$1,108.00 - $1,128.00Quantity
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$0.00
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Subtotal
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