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Quick Details

  • Other Names: bonding black adhesive/glue
  • Place of Origin: Guangdong, China (Mainland)
  • Classification: Other Adhesives
  • Main Raw Material: Epoxy
  • Usage: IC potting/ COB bonding
  • Brand Name: WTS
  • Model Number: 9006
  • colour: black

Packaging & Delivery

Packaging Details: 5kg
Delivery Detail: within 15 days after receipt your L/C or T/T in advance

9006 bonding adhesive/glue IC potting/encapsulant/COB

1 for IC potting COB bonding
2 strong adhesion with PCB
3 thermal conductive
4 good electrical property
5 low gel point


1.single component,epoxy resin

2. do not flow when cure

3. strong adhesive strength after cure

4. low coefficient of thermal expansion

5. with good thermal conductivity,avoid short circuit

6. withstand temperature changes

7. anti-corrosion


 widely used for IC potting such as electronic watches, calculators, computers, LCD modules, e-books, semiconductor components and COB bonding


physical properties

Viscosity ( at 25°c)



Black paste



Curing time (150 ° C)

40~60 mins 

Specific gravity

1.48  g/ml

Shelf 5 °C

6 months (cold storage)

Life (opened)

7 days 

properties after cure 

Shrinkage rate


Resistance to soldering heat,
430 °C solder solution

3 s

Water absorption

24 h,25 °C


24 h,100 °C


Heat distortion temperature

160 °C   

Peak temperature

135 °C

Glass transition temperature

127 °C

Expansion coefficient ,100 °C,24h


Dielectric loss tangent,1HKZ


Impact strength

9~11  kg/cm/cm

Compressive strength

12~13  kg/mm2

Tensile strength

11~13  kg/mm2

Tensile strength(RM) 

13~15  kg/mm2

Extension rate


Breakdown voltage 25 °C

20~23  KV / mm

Surface resistance 25 °C

2X1015  0hm/cm 

Volume resistance 25 °C

5X1010   0hm/cm

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